Article

Data-driven Digital Twin for Board-Level Packaging Interconnects under Multi-physics Loading

2023-03-24

Abstract excerpt

<title>Abstract</title> <p>Solder joints of electronic packaging devices are used as mechanical fixation and electrical interconnection between chips and circuit boards, which provides protection for the normal operation of electronic equipment. Therefore, real-time monitoring of the status of solder joints is essential for predictive maintenance of equipment. In this paper, we propose a digital twin based on sem...

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Literature Corpus work: 21728fa7-546b-5871-bfb4-5d914d85e100
DOI: 10.21203/rs.3.rs-2716859/v1

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